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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6333-B Issued Date : 1992.11.18 Revised Date : 2000.10.01 Page No. : 1/4 HMPSA64 PNP SILICON TRANSISTOR Description The HMPSA64 is designed for application requiring extremely high current gain at collector currents to 500mA. Features * High D.C Current Gain * For Complementary Use with NPN Type HMPSA14 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... -30 V VCEO Collector to Emitter Voltage .................................................................................... -30 V VEBO Emitter to Base Voltage .......................................................................................... -10 V IC Collector Current ...................................................................................................... -500 mA Characteristics (Ta=25C) Symbol BVCBO BVCES BVEBO ICBO IEBO *VCE(sat) VBE(on) *hFE1 *hFE2 fT Min. -30 -30 -10 10 20 125 Typ. Max. -100 -100 -1.5 -2 Unit V V V nA nA V V K K pF Test Conditions IC=-100uA, IE=0 IC=-100uA, IB=0 IE=-10uA, IC=0 VCB=-30V, IE=0 VEB=-10V, IC=0 IC=-100mA, IB=-0.1mA IC=-100mA, VCE=-5V IC=-10mA, VCE=-5V IC=-100mA, VCE=-5V IC=-100mA, VCE=-5V, f=100MHZ *Pulse Test : Pulse Width 380us, Duty Cycle2% HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 100000 10000 Spec. No. : HE6333-B Issued Date : 1992.11.18 Revised Date : 2000.10.01 Page No. : 2/4 Saturation Voltage & Collector Current VCE=5V 10000 Saturation Voltage (mV) hFE 1000 VCE(sat) @ IC=1000IB 1000 10 100 1000 100 1 10 100 1000 Collector Current (mA) Collector Current (mA) On Voltage & Collector Current 10 100 Capacitance & Reverse-Biased Voltage On Voltage (mV) Capacitance (Pf) 10 Cob VBE(on) @ VCE=5V 1 1 10 100 1000 1 1 10 100 Collector Current (mA) Reverse Biased Voltage (V) Cutoff Frequency & Ic 1000 10 Safe Operating Area PT=1ms Cutoff Rrequency (MHz) Collector Current (mA) 1 PT=100ms PT=1s fT 100 0.1 10 1 10 100 1000 0.01 0.1 1 10 100 Collector Current (mA) Forward Voltage (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6333-B Issued Date : 1992.11.18 Revised Date : 2000.10.01 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD(mW) 500 400 300 200 100 0 0 20 40 60 80 100 o 120 140 160 Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 12 3 Spec. No. : HE6333-B Issued Date : 1992.11.18 Revised Date : 2000.10.01 Page No. : 4/4 2 Marking : HSMC Logo Part Number Date Code Rank Product Series 3 Laser Mark HSMC Logo Product Series C D Part Number H I E F G Ink Mark Style : Pin 1.Emitter 2.Base 3.Collector 1 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification |
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